Success Stories

RFID chips are used storing process informations for an industrial process. During this process, there is one step, which heats up the RFID chip. The unresponsiveness time for the current technical solution after the heating phase is more then 10 minutes.

Target of this analysis was to reduce without additional manufacturing costs the unresponsiveness time by 50 %. A conceptual brainstorming together with the development partner Plastel and first analytical investigations were the input of the optimization process with Finite Element Method.

The new designed RFID housing (injection molding) with an optimized placement of the chip shows a reduction of unresponsiveness more than 60 %. Beside the expertise of the manufacturing feasibility of Plastel and the customer Maxsol, the virtual thermal analysis saved dramatically development time and cost to introduce the new product into series production.

A reference for Suisse TP’s ALUCOBOND media®

The first big product innovation that Suisse Technology Partners introduced to the market is ALUCOBOND media®. It is the world’s first fully integrated media façade solution with a seamlessly integrated dot that gives architects and lighting designers the opportunity to create facades with stunning effects. The Axel Springer publishing house headquarter in Hamburg is the first reference for this product where each of the 2,600 LED-dots can be controlled individually to run animations and lighting effects on the cladding. Even though the product was designed as an outdoor solution it converts the interior of the Springer entrance hall to a dynamic statement.

See more about the product and that project on alucobond-media.ch

New insights into yarn packages

While 3D-X-ray-tomography is well known in the healthcare business, many industrial applications are still waiting to be established. Suisse Technology Partners has recently demonstrated that this technology can successfully be used in order to measure the quality of yarn dye packages. Density variations in dye packages are know to cause problems during the dying procedure. No method was so far available to identify winding irregularities and density variations before the dying process. Using reference materials of know density and quantitative evaluation algorithms for the x-ray transmission images the local density at each point in the package can be determined reliably. The pictures to the right show the density distribution in a homogeneous (lower picture) and an inhomogeneous (upper) dye package. This test is of course non-destructive. With the resulting information the package quality can be evaluated and the winding process be optimized.